A second curve exists today in nascent, only partly quantified form, and the report is careful not to overstate how proven it is. The clearest one is the services and consumables layer: wafer regeneration, maintenance and spare parts generated CNY 594.2 million in 2025, just 12.8% of revenue, but grew 61.2% year on year against 36.5% for the equipment business, and carried a 48.2% gross margin versus 40.9% for equipment. That is a real, already-existing installed-base annuity — still small.
The more ambitious candidate is the broader tool platform: thinning, ion implantation (built out through the December 2024 ChipY acquisition, completed March 2025 for up to CNY 1.0045 billion), wet tools, and wafer-regeneration capacity (a planned 200,000-wafer-per-month expansion in Kunshan). These exist as product lines and are funded by a 2026 private-placement plan of up to CNY 4.0 billion, but the company no longer discloses their individual revenue contribution, so their scale cannot be verified from primary filings.
The most headline-grabbing candidate is panel-level CMP for advanced packaging: the June 2026 order for the Master-P510APEX system, described as China's first fully automatic panel-level CMP production order. The report explicitly calls this "the cleanest second growth curve signal in the entire current narrative," and separate reporting on the company's 1,000th-unit shipment milestone confirms its CMP tools already span IC, power semiconductor, 3D integration/advanced packaging, compound semiconductor and display substrates (Sina Finance), suggesting real application breadth. But the order itself carries no disclosed customer, value, or revenue-recognition schedule.
So: a second curve exists in direction and early scale, but its size is unproven, and the report treats that gap as the central unresolved question five years out rather than a settled fact.