Union Semiconductor (Hefei) Co. Ltd. A
科技 · 半导体
Union Semiconductor (Hefei) Co., Ltd. provides packaging and testing services for integrated circuits to display driver chip design companies in China and internationally. The company provides bump manufacturing (bumping), wafer testing (CP), chip on glass (COG), and chip on film (COF) processing services. Its products are used primarily in smartphones, HDTVs, laptops, tablets, automotive electronics, smart wearables, and electronic tags categories. The company was founded in 2015 and is headquartered in Hefei, China.
MARKET 市值 31.02B CNY PE 260.8x
52W ¥9.54 – ¥43.3
EODHD · Q 2026-03-31 · 同步 2026-07-14
QUALITY PEG — 营收 YoY 9.7%
▲ ROE 2.8% 营业利润率 0.7% 净利润率 5.6%
ANALYST 股息率 0.14%