Hefei Chipmore Technology Co.,Ltd. operates as a packaging and testing service provider for integrated circuits in China and internationally. The company offers packaging and testing solutions, including bump processing, wafer testing, grinding and cutting, packaging and testing; and support services, such as photomask design, COF tape-on-feed design, substrate/frame design, test program development, probe card/POGO PIN design and repair, and thin film flip chip tape design. Its packaging and testing products include various display driver chips, power management chips, and RF front-end chips used for applications in televisions, smartphones, automotive electronics, ablets, laptops, HDTVs, smart wearables, electronic communications, and industrial control. Hefei Chipmore Technology Co.,Ltd. was founded in 2004 and is based in Suzhou, China.