纵横研报
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688216.SHG

¥39.08-5.72% 气派科技 Semiconductors
00Reports China 科技
China Chippacking Technology Co. Ltd. A
科技 · 半导体

China Chippacking Technology Co.,Ltd. provides integrated circuit packaging and testing services in China and internationally. The company offers CPC, ECPC, DFN, QFN, LQFP, MSOP, DIP, QIPAI, EMSOP, SOP, tODAY, SSOP, HSOP, TO, TSSOP, ESOP, and TSOT, as well as MEMS,FC, 5G nitride automotive, home RF devices in plastic packages, such as QFN/DFN, CQFN/CDFN, SOT, DIP, and PDFN packaging forms. Its products are used in consumer electronics, information and communication, smart home, IoT, industrial automation control, and automotive electronics applications. The company also provides power device packaging and testing, and wafer testing services. The company was founded in 2006 and is based in Dongguan, China.

MARKET 市值 4.27B CNY 52W ¥20.03 – ¥51.3 EODHD · Q 2026-03-31 · 同步 2026-07-12
QUALITY PEG 营收 YoY 69.8% ROE -7.4% 营业利润率 2.0% 净利润率 -5.5%

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