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Ticker Detail

688035.SHG

¥75.3-6.23% 德邦科技 Chemicals
00Reports China 基础材料
Darbond Technology Co. Ltd. A
基础材料 · 化工

Darbond Technology Co., Ltd engages in the research and development, production, and sale of electronic packaging materials in China. The company offers electronic-grade adhesives and functional thin-film materials, integrated circuit packaging, smart terminal packaging materials, new energy application materials, and high end equipment application products. It also offers solutions, including integrated circuit solutions panel display solutions, intelligent devices, and power battery solutions. The company also engages in research and development, manufacturing, and sale of thermal conductive interface materials. Darbond Technology Co., Ltd was founded in 2003 and is headquartered in Yantai, China.

MARKET 市值 14.24B CNY PE 123.6x 52W ¥39.55 – ¥107.28 EODHD · Q 2026-03-31 · 同步 2026-07-12
QUALITY PEG 营收 YoY 28.5% ROE 4.9% 营业利润率 12.4% 净利润率 7.0%
ANALYST 股息率 0.25%

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