Shennan Circuits Co., Ltd. engages in the design, manufacture, and sale of printed circuit boards, packaging substrates, and electronic assemblies in China and internationally. It operates through Packaging Substrates, Packaging Substrates, and Distribution Substrates segments. The company provides RF and microwave, thermal management, miniaturization, and chip package substrate solutions. It also offers schematic design, PCB / SiP design, PCB / SUB production, electronic assembly, package testing, and other value creations. The company was formerly known as CATIC Shenzhen Shennan Circuit Company and changed its name to Shennan Circuits Co., Ltd. in January 2000. The company was incorporated in 1984 and is headquartered in Shenzhen, China. Shennan Circuits Co., Ltd. operates as a subsidiary of AVIC International Holdings Limited.