Tianshui Huatian Technology Co., Ltd., together with its subsidiaries, engages in research, development, production, packaging, testing, and sales of semiconductor integrated circuits in China and internationally. It offers integrated circuit packaging products, including multiple series such as DIP, SOT, SOP, QFP, QFN/DFN, BGA/LGA, FC, MCM, SiP, WLP, TSV, Bumping, MEMS, FO, PLP, and 2.5D/3D. It is used in electronic assemblies and intelligent fields, such as computers, network communications, consumer electronics and smart mobile terminals, the Internet of Things, industrial automation control, and automotive electronics. The company is also involved in engineering and electromechanical; import and export trade; and investment activities. It exports its products. Tianshui Huatian Technology Co., Ltd. was founded in 2003 and is headquartered in Tianshui, China.